Webinars

Proven to Lead: Advancing TEM Sample Preparation with Tescan AMBER X 2 Plasma FIB-SEM

University of Sydney and Tescan demonstrate how plasma FIB-SEM delivers both high-volume 3D characterization and precise TEM specimen preparation in a single universal system.

Meet the speakers:
Mr. Felix Theska (University of Sydney): Senior Technical Officer at Sydney Microscopy & Microanalysis, University of Sydney, supports researchers in specimen preparation for atom probe tomography and transmission electron microscopy using Ga+, Xe+, and Ar+ FIB-SEM systems.
Martin Sláma (TESCAN): Product Marketing Manager for FIB-SEM 3D characterization and TEM lamella preparation at Tescan, brings eight years of experience with plasma FIB and Ga+ FIB-SEM solutions for materials characterization.

Low Voltage Electron Microscopy for Biological Thin Sections

Join us in the “Low Voltage Electron Microscopy for Biological Thin Sections” webinar and discover how low voltage electron microscopy (LVEM) is a revolutionary alternative for high-voltage transmission electron microscopy (HV-TEM) for biological applications, providing not only high-quality images but also a simpler and more affordable tool to support researchers and pathologists around the world. The first 2025 “Delong Discussions” will showcase the advantages of LVEM for imaging thin sections and obtaining detailed cellular structures.

For about 50 years, the gold standard in TEM analysis has relied on HV-TEM combined with heavy metal staining. While this method delivers high-quality images, it comes with major drawbacks: complex sample prep, the need for staining, high beam energy that can damage samples, and expensive equipment. Delong Instruments’ LVEM microscopes address these issues with a compact, affordable design that delivers higher contrast images—no heavy metal staining required.

From Routine to Remarkable: Meet Tescan MIRA XR

Experience how MIRA XR's advanced capabilities transform your analysis workflows in real-time demonstrations. Connect with Tescan experts to discover practical applications that enhance your research and quality control processes.

Speaker: Tomáš Borůvka
Product Marketing Manager – SEM Solutions in Materials Science at Tescan. Drawing on his background in R&D, he brings together user perspective and technical understanding.

Powering the Future: Unveiling Battery Electrode Secrets with AFM-in-SEM

Join us to explore How AFM-in-SEM is revolutionizing battery research and materials analysis.
Speaker: Ms. Veronika Hegrová - Application Manager (NenoVision)

In Situ and Dynamic Imaging with TESCAN Micro-CT

TESCAN is pushing the boundaries of materials characterization with dynamic micro-CT imaging. By capturing the evolution of materials in real-time, we enable researchers to gain deeper insights into material behaviour under various conditions. Advancements in micro-CT imaging have enabled scientists to understand and observe fluid migration in complex geological materials such as soils and reservoirs. The TESCAN dynamic micro-CT systems, in particular, have provided new insights into the subsurface world by bringing real-time pore-scale imaging from synchrotrons to the lab.
Speaker: PhD. Marijn Boone (Product Marketing Manager for micro-CT at TESCAN Group)

Enhancing Atom Probe Tomography – Precision Preparation with TESCAN FIB-SEM

Join our upcoming webinar to explore how TESCAN’s Focused Ion Beam Scanning Electron Microscopy (FIB-SEM) technology enhances Atom Probe Tomography (APT) specimen preparation.

For scientists and researchers focused on atomic-scale materials analysis, mastering the intricacies of APT specimen preparation is essential. In this online session in cooperation with Cameca Instruments, you’ll learn how TESCAN’s FIB-SEM systems enable precise preparation with minimal sample damage, essential for achieving accurate and reliable results in APT analysis.

Webinar Title: FIB-SEMs: A Critical Tool for Precision in Atom Probe Tomography (APT)

Status: Waiting the Recorded Video

5 ứng dụng trên Máy đo 5 trục, tiếp cận vùng khó đo, và đo tự động

Quý bạn đang sử dụng Máy đo 3D CMM, hoặc/và Máy đo quang học để kiểm tra/kiểm soát chất lượng sản phẩm (QC/QA/KCS)?
Quý bạn gặp nhiều khó khăn trong việc tiếp cận vùng cần đo phức tạp, nơi có nhiều thông số quan trọng cần đo?
Hãy để chúng tôi giúp bạn bằng Máy FocusX và Bộ Real3DUnitX độc đáo khác biệt, "một click" vào file CAD 3D là đủ.

Thời gian Webinar: đã diễn ra (Đăng ký xem lại recorded video)

FIB-SEM Microscopy Introduction to Semicon FA and R&D

The continuous drive for miniaturization, efficiency, and integration in semiconductor devices is pushing boundaries in both design and manufacturing. As a result, the challenges faced by researchers and engineers in failure analysis (FA) and sample preparation are more complex than ever.
For professionals working in this space, having reliable and efficient tools to prepare and analyze samples is critical to maintaining progress. This is why we invite you to our upcoming webinar to explore our suite of FIB-SEM solutions, designed specifically for semiconductor FA and R&D laboratories.
In this online session, we’ll be walking through the role these systems play in sample preparation workflows, highlighting how precision, automation, and ease of use can boost your lab’s productivity.

Title: FIB-SEM Microscopy Introduction to Semicon FA and R&D

Status: Recorded Video is available for reviewing

A 4-Part Webinar Series by TESCAN and WAS (AMBER 2 and AMBER X 2)

TESCAN is thrilled to announce a series of four informative webinars exploring the latest advancements in materials analysis technology. These online events, held in collaboration with Wiley Analytical Science (WAS), will showcase the capabilities of our newest FIB-SEM systems, Plasma FIB-SEM AMBER X 2 and Ga FIB-SEM AMBER 2.

Status: Recorded Video is available for reviewing

Title: FIB-SEM Microscopy Introduction to Semicon FA and R&D

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