Nền tảng FIB SEM plasma được tối ưu hóa phục vụ quá trình nghiên cứu chế tạo các thiết bị bán dẫn hiện đại nhất với hóa chất độc quyền

  • Low-kV high-resolution imaging with enhanced topographic contrast of target layers
  • Imaging of edges of delayered or cleaved chips using field-free high-resolution technology
  • Dedicated and proprietary gas chemistries for sub-14 nm nodes deprocessing
  • End-pointing software module for semiautomated deprocessing enables stopping the process at a desired layer
  • Electrical characterization of the most sensitive semiconductor devices using in-situ nanoprobing
  • Easy-to-use, fully customizable, applicationoriented and modular user interface

TCL layer, Intel 14 nm Skylake

Overview of a 100 μm × 100 μm delayered window on a 10 nm technology node

Nanoprobing a delayered 10 nm technology node

Yêu cầu báo giá - SEM TESCAN